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PI · grade · default condition

PI Unfilled

Properties of the Unfilled condition, compared with the other PI grades.

Pick when electrical insulation, maximum elongation/toughness and cleanliness matter more than wear life.

What is PI Unfilled?

PI Unfilled is PI in the Unfilled grade — pick when electrical insulation, maximum elongation/toughness and cleanliness matter more than wear life. PI Unfilled has a tensile strength of 86 MPa (12.5 ksi), stronger than 86% of polymer grades. Elongation at break is 7.5% and the elastic modulus is 3 GPa (0.435 Msi). PI Unfilled has a density of 1.43 g/cm³ (0.0517 lb/in³), heavier than 84% of polymer grades. Its glass-transition temperature is 385°C (725 °F).

Advantages

  • High service temperature — 260°C (500 °F), better than 97% of polymer grades
  • Good UV / weathering resistance — 60/100, better than 80% of polymer grades
  • Conducts heat well — 0.29 W/m·K (0.168 BTU/hr·ft·°F), better than 79% of polymer grades

Limitations

  • High embodied carbon — 13 kg CO₂/kg, worse than 93% of polymer grades
  • Difficult to weld — 5/100, worse than 90% of polymer grades
  • Heavy — 1.43 g/cm³ (0.0517 lb/in³), worse than 84% of polymer grades
  • Limited formability — 15/100, worse than 80% of polymer grades

PI Unfilled properties

Typical room-temperature values for PI Unfilled — 14 properties are specific to this condition; the rest are grade-level values shared by every PI grade. Each bar shows where the value sits among the polymer grades in FabDigit's library — further right is higher.

Physical5

PI Unfilled has a density of 1.43 g/cm³ (0.0517 lb/in³), heavier than 84% of polymer grades. Its glass-transition temperature is 385°C (725 °F).

Density1.43 g/cm³0.05 lb/in³
Glass Transition (Tg)385°C725 °F
Water Absorption (24 h)0.3%
Water Absorption (Saturation)1.2%
Refractive Index1.7

Mechanical15

PI Unfilled has a tensile strength of 86 MPa (12.5 ksi), stronger than 86% of polymer grades. Elongation at break is 7.5% and the elastic modulus is 3 GPa (0.435 Msi).

Elastic (Young's) Modulus3 GPa0.44 Msi
Shear Modulus1.1 GPa0.16 Msi
Bulk Modulus6 GPa0.8 Msi
Poisson's Ratio0.41
Tensile Strength (Ultimate)86 MPa12.5 ksi
Elongation at Break7.5%
Compressive Strength130 MPa18.9 ksi
Compressive Modulus2.9 GPa0.42 Msi
Flexural Strength110 MPa16 ksi
Flexural Modulus3.1 GPa0.45 Msi
Shear Strength80 MPa11.6 ksi
Fracture Toughness (K_IC)2 MPa·√m1.8 ksi·√in
Izod Impact, Notched43 J/m0.81 ft·lbf/in
Hardness, Shore D88 Shore D
Hardness, Rockwell M105 HRM

Thermal10

PI Unfilled is rated for continuous service to 260°C (500 °F). It conducts heat at 0.29 W/m·K (0.168 BTU/hr·ft·°F), better than 79% of polymer grades. Thermal expansion is 52 µm/m·K (28.9 µin/in·°F).

Thermal Conductivity0.29 W/m·K0.17 BTU/hr·ft·°F
Specific Heat Capacity1,130 J/kg·K0.27 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)52 µm/m·K28.9 µin/in·°F
Max Service Temperature (continuous)260°C500 °F
Min Service Temperature-240°C-400 °F
Heat Deflection Temp. @ 0.45 MPa400°C752 °F
Heat Deflection Temp. @ 1.8 MPa360°C680 °F
Flammability (UL 94)V-0 (typically at ≥0.4 mm; inherently flame retardant, very low smoke)
Limiting Oxygen Index45%
Max Service Temperature (short-term)480°C896 °F

Electrical6

PI Unfilled is an electrical insulator with a dielectric strength of 22 kV/mm (558.8 V/mil) and a resistivity of 1×10¹⁴ Ω·m.

Electrical Resistivity1×10¹⁴ Ω·m3.94×10²¹ µΩ·in
Dielectric Strength22 kV/mm559 V/mil
Dielectric Constant (1 MHz)3.5
Dissipation Factor (1 MHz)0.0034
Volume Resistivity1×10¹⁶ Ω·cm
Surface Resistivity1×10¹⁵ Ω

Chemical & Environmental3

Corrosion resistance is excellent (85/100), better than 63% of polymer grades. UV resistance is good.

Corrosion ResistanceExcellent85/100
UV / Weathering ResistanceGood60/100
Chemical Resistance SummaryExcellent against hydrocarbons, ketones, esters, aromatic/chlorinated solvents, oils, fuels, radiation and high vacuum; attacked by strong bases (NaOH, ammonia), hydrazine, concentrated acids and long-term hot water/steam (hydrolysis of the imide ring).

Sustainability4

Producing a kilogram of PI Unfilled takes about 290 MJ of energy and emits 13 kg of CO₂ — more than 95% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)290 MJ/kg124,678 BTU/lb
Embodied Carbon (primary production)13 kg CO₂/kg
Embodied Water600 L/kg71.9 gal/lb
Typical Recycled Content0%

Manufacturability4

PI Unfilled's machinability is good (65/100, better than 66% of polymer grades); weldability not recommended (5/100); formability poor (15/100).

MachinabilityGood65/100
WeldabilityNot recommended5/100
Formability (cold)Poor15/100
PolishabilityGood60/100

Common Calculations4

Specific Strength (UTS / density)calculated60 kN·m/kg
Specific Stiffness (E / density)calculated2.1 MN·m/kg
Thermal Diffusivitycalculated0.2 mm²/s
Thermal Shock Resistance Indexcalculated0

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Other PI grades and fills

PI is also supplied in 7 other conditions. The full side-by-side table is on the PI overview.

Working with PI Unfilled

Is PI easy to machine?

Machines dry with sharp polished carbide (PCD for graphite/CF grades), light feeds and good chip clearance; brittle at edges so avoid sharp internal corners and stress-relieve/anneal after heavy cuts.

Can PI be welded?

Not weldable — non-melting (except TPI grades); join by high-temperature epoxy/polyimide adhesive, press-fit or mechanical fastening.

Can PI be formed, bent or molded?

Kapton-type film is cast/extruded and can be laminated or thermoformed only slightly; Vespel-type stock is direct-formed (isostatic pressing + sintering) and then machined; only thermoplastic PI can be injection molded (melt 400–420 °C, mold 180–230 °C, dry resin thoroughly).

What surface finishes work on PI?

Amber natural color needs no coating; can be plasma/alkaline-etch activated for metallization and adhesive bonding; polishes to a fine matte finish, no paint/anodize required.

PI chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
graphite15 % in SP-21, 40 % in SP-220 – 400
PTFE10 % in SP-2110 – 100
MoS215 % in SP-3 (vacuum grade)0 – 150
carbon fiberstructural CF-reinforced grades0 – 400
polyimide resin (PMDA–ODA type aromatic pyromellitic dianhydride + 4,4'-oxydianiline backbone; unfilled default gradebalance

PI Unfilled — frequently asked

What is PI Unfilled used for?

PI Unfilled is typically used for wire and cable insulation film, aerospace and satellite structural parts, unlubricated bushings and thrust washers, seal rings and piston rings for high-temperature service, semiconductor process components and flexible circuit substrates. In short: ultimate aerospace performance.

What is the tensile strength of PI Unfilled?

PI Unfilled has a typical tensile strength of 86 MPa (12.5 ksi) — stronger than 86% of polymer grades. Strength varies by condition: see the 8 listed tempers.

Is PI Unfilled easy to machine?

Reasonably — machinability is rated good (65/100, better than 66% of polymer grades). Machines dry with sharp polished carbide (PCD for graphite/CF grades), light feeds and good chip clearance; brittle at edges so avoid sharp internal corners and stress-relieve/anneal after heavy cuts.

Can PI Unfilled be welded?

Not readily — weldability is rated not recommended (5/100). Not weldable — non-melting (except TPI grades); join by high-temperature epoxy/polyimide adhesive, press-fit or mechanical fastening.

What surface finishes work on PI Unfilled?

Amber natural color needs no coating; can be plasma/alkaline-etch activated for metallization and adhesive bonding; polishes to a fine matte finish, no paint/anodize required.

Can PI Unfilled be formed, bent or molded?

Kapton-type film is cast/extruded and can be laminated or thermoformed only slightly; Vespel-type stock is direct-formed (isostatic pressing + sintering) and then machined; only thermoplastic PI can be injection molded (melt 400–420 °C, mold 180–230 °C, dry resin thoroughly).

What is the maximum service temperature of PI Unfilled?

PI Unfilled is rated for continuous use to about 260°C (500 °F), and briefly to 480°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Can FabDigit make parts in PI Unfilled?

Yes — PI Unfilled is available for CNC machining, sheet metal and injection molding with instant online pricing. Upload a STEP file to get a price and a DFM check.

Sources

  1. Vespel SP-1 / SP-21 / SP-22 / SP-211 / SP-3 polyimide parts and shapes design handbookDuPont (2021)
  2. Kapton HN polyimide film — summary of propertiesDuPont (2022)
  3. Duratron PI / CU60 polyimide stock shapes datasheetMitsubishi Chemical Advanced Materials (2022)
  4. Meldin 7001 / 7211 / 7220 polyimide datasheetsSaint-Gobain Performance Plastics (2021)
  5. AURUM thermoplastic polyimide product guideMitsui Chemicals (2020)
  6. Engineered Materials Handbook Vol. 2: Engineering PlasticsASM International (1988)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.