FabDigit

PI · reinforced grade

PI-CF30

Properties of the CF30 condition, compared with the other PI grades.

Choose for maximum stiffness, creep resistance and lowest CTE in structural high-temperature parts.

What is PI-CF30?

PI-CF30 is PI in the CF30 grade — choose for maximum stiffness, creep resistance and lowest CTE in structural high-temperature parts. PI-CF30 has a tensile strength of 100 MPa (14.5 ksi), stronger than 89% of polymer grades. Elongation at break is 2% and the elastic modulus is 12 GPa (1.74 Msi). PI-CF30 has a density of 1.45 g/cm³ (0.0524 lb/in³), heavier than 85% of polymer grades. Its glass-transition temperature is 385°C (725 °F). Unfilled is the default condition FabDigit quotes; CF30 is available on request or by drawing note.

Advantages

  • Conducts heat well — 1.2 W/m·K (0.693 BTU/hr·ft·°F), better than 100% of polymer grades
  • High service temperature — 300°C (572 °F), better than 99% of polymer grades
  • Stiff — 12 GPa (1.74 Msi), better than 97% of polymer grades
  • Good UV / weathering resistance — 60/100, better than 80% of polymer grades

Limitations

  • Limited ductility — 2%, worse than 94% of polymer grades
  • High embodied carbon — 13 kg CO₂/kg, worse than 93% of polymer grades
  • Difficult to weld — 5/100, worse than 90% of polymer grades
  • Heavy — 1.45 g/cm³ (0.0524 lb/in³), worse than 85% of polymer grades
  • Difficult to machine — 35/100, worse than 84% of polymer grades

PI-CF30 properties

Typical room-temperature values for PI-CF30 — 10 properties are specific to this condition; the rest are grade-level values shared by every PI grade. Each bar shows where the value sits among the polymer grades in FabDigit's library — further right is higher.

Physical5

PI-CF30 has a density of 1.45 g/cm³ (0.0524 lb/in³), heavier than 85% of polymer grades. Its glass-transition temperature is 385°C (725 °F).

Density1.45 g/cm³0.05 lb/in³
Glass Transition (Tg)385°C725 °F
Water Absorption (24 h)0.3%
Water Absorption (Saturation)1.2%
Refractive Index1.7

Mechanical15

PI-CF30 has a tensile strength of 100 MPa (14.5 ksi), stronger than 89% of polymer grades. Elongation at break is 2% and the elastic modulus is 12 GPa (1.74 Msi).

Elastic (Young's) Modulus12 GPa1.7 Msi
Shear Modulus1.1 GPa0.16 Msi
Bulk Modulus6 GPa0.8 Msi
Poisson's Ratio0.41
Tensile Strength (Ultimate)100 MPa14.5 ksi
Elongation at Break2%
Compressive Strength130 MPa18.9 ksi
Compressive Modulus2.9 GPa0.42 Msi
Flexural Strength150 MPa21.8 ksi
Flexural Modulus11 GPa1.6 Msi
Shear Strength80 MPa11.6 ksi
Fracture Toughness (K_IC)2 MPa·√m1.8 ksi·√in
Izod Impact, Notched43 J/m0.81 ft·lbf/in
Hardness, Shore D88 Shore D
Hardness, Rockwell M105 HRM

Thermal10

PI-CF30 is rated for continuous service to 300°C (572 °F). It conducts heat at 1.2 W/m·K (0.693 BTU/hr·ft·°F), better than 100% of polymer grades. Thermal expansion is 22 µm/m·K (12.2 µin/in·°F).

Thermal Conductivity1.2 W/m·K0.69 BTU/hr·ft·°F
Specific Heat Capacity1,130 J/kg·K0.27 BTU/lb·°F
Thermal Expansion (CTE, 20–100 °C)22 µm/m·K12.2 µin/in·°F
Max Service Temperature (continuous)300°C572 °F
Min Service Temperature-240°C-400 °F
Heat Deflection Temp. @ 0.45 MPa400°C752 °F
Heat Deflection Temp. @ 1.8 MPa360°C680 °F
Flammability (UL 94)V-0 (typically at ≥0.4 mm; inherently flame retardant, very low smoke)
Limiting Oxygen Index45%
Max Service Temperature (short-term)480°C896 °F

Electrical6

PI-CF30 is an electrical insulator with a dielectric strength of 22 kV/mm (558.8 V/mil) and a resistivity of 1×10¹⁴ Ω·m.

Electrical Resistivity1×10¹⁴ Ω·m3.94×10²¹ µΩ·in
Dielectric Strength22 kV/mm559 V/mil
Dielectric Constant (1 MHz)3.5
Dissipation Factor (1 MHz)0.0034
Volume Resistivity1×10¹⁶ Ω·cm
Surface Resistivity1×10¹⁵ Ω

Chemical & Environmental3

Corrosion resistance is excellent (85/100), better than 63% of polymer grades. UV resistance is good.

Corrosion ResistanceExcellent85/100
UV / Weathering ResistanceGood60/100
Chemical Resistance SummaryExcellent against hydrocarbons, ketones, esters, aromatic/chlorinated solvents, oils, fuels, radiation and high vacuum; attacked by strong bases (NaOH, ammonia), hydrazine, concentrated acids and long-term hot water/steam (hydrolysis of the imide ring).

Sustainability4

Producing a kilogram of PI-CF30 takes about 290 MJ of energy and emits 13 kg of CO₂ — more than 95% of polymer grades. Typical recycled content is 0%.

Embodied Energy (primary production)290 MJ/kg124,678 BTU/lb
Embodied Carbon (primary production)13 kg CO₂/kg
Embodied Water600 L/kg71.9 gal/lb
Typical Recycled Content0%

Manufacturability4

PI-CF30's machinability is fair (35/100, worse than 84% of polymer grades); weldability not recommended (5/100); formability poor (15/100).

MachinabilityFair35/100
WeldabilityNot recommended5/100
Formability (cold)Poor15/100
PolishabilityGood60/100

Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.

Other PI grades and fills

PI is also supplied in 7 other conditions. The full side-by-side table is on the PI overview.

Working with PI-CF30

Is PI easy to machine?

Machines dry with sharp polished carbide (PCD for graphite/CF grades), light feeds and good chip clearance; brittle at edges so avoid sharp internal corners and stress-relieve/anneal after heavy cuts.

Can PI be welded?

Not weldable — non-melting (except TPI grades); join by high-temperature epoxy/polyimide adhesive, press-fit or mechanical fastening.

Can PI be formed, bent or molded?

Kapton-type film is cast/extruded and can be laminated or thermoformed only slightly; Vespel-type stock is direct-formed (isostatic pressing + sintering) and then machined; only thermoplastic PI can be injection molded (melt 400–420 °C, mold 180–230 °C, dry resin thoroughly).

What surface finishes work on PI?

Amber natural color needs no coating; can be plasma/alkaline-etch activated for metallization and adhesive bonding; polishes to a fine matte finish, no paint/anodize required.

PI chemical composition (wt %)

Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.

ElementSpec limit (wt %)Nominal
graphite15 % in SP-21, 40 % in SP-220 – 400
PTFE10 % in SP-2110 – 100
MoS215 % in SP-3 (vacuum grade)0 – 150
carbon fiberstructural CF-reinforced grades0 – 400
polyimide resin (PMDA–ODA type aromatic pyromellitic dianhydride + 4,4'-oxydianiline backbone; unfilled default gradebalance

PI-CF30 — frequently asked

What is PI-CF30 used for?

PI-CF30 is typically used for wire and cable insulation film, aerospace and satellite structural parts, unlubricated bushings and thrust washers, seal rings and piston rings for high-temperature service, semiconductor process components and flexible circuit substrates. In short: ultimate aerospace performance.

What is the tensile strength of PI-CF30?

PI-CF30 has a typical tensile strength of 100 MPa (14.5 ksi) — stronger than 89% of polymer grades. Strength varies by condition: see the 8 listed tempers.

Is PI-CF30 easy to machine?

Not especially — machinability is rated fair (35/100, worse than 84% of polymer grades). Machines dry with sharp polished carbide (PCD for graphite/CF grades), light feeds and good chip clearance; brittle at edges so avoid sharp internal corners and stress-relieve/anneal after heavy cuts.

Can PI-CF30 be welded?

Not readily — weldability is rated not recommended (5/100). Not weldable — non-melting (except TPI grades); join by high-temperature epoxy/polyimide adhesive, press-fit or mechanical fastening.

What surface finishes work on PI-CF30?

Amber natural color needs no coating; can be plasma/alkaline-etch activated for metallization and adhesive bonding; polishes to a fine matte finish, no paint/anodize required.

Can PI-CF30 be formed, bent or molded?

Kapton-type film is cast/extruded and can be laminated or thermoformed only slightly; Vespel-type stock is direct-formed (isostatic pressing + sintering) and then machined; only thermoplastic PI can be injection molded (melt 400–420 °C, mold 180–230 °C, dry resin thoroughly).

What is the maximum service temperature of PI-CF30?

PI-CF30 is rated for continuous use to about 300°C (572 °F), and briefly to 480°C. Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.

Can FabDigit make parts in PI-CF30?

Yes — PI-CF30 is available for CNC machining, sheet metal and injection molding with instant online pricing. Upload a STEP file to get a price and a DFM check.

Sources

  1. Vespel SP-1 / SP-21 / SP-22 / SP-211 / SP-3 polyimide parts and shapes design handbookDuPont (2021)
  2. Kapton HN polyimide film — summary of propertiesDuPont (2022)
  3. Duratron PI / CU60 polyimide stock shapes datasheetMitsubishi Chemical Advanced Materials (2022)
  4. Meldin 7001 / 7211 / 7220 polyimide datasheetsSaint-Gobain Performance Plastics (2021)
  5. AURUM thermoplastic polyimide product guideMitsui Chemicals (2020)
  6. Engineered Materials Handbook Vol. 2: Engineering PlasticsASM International (1988)

Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.