Solder & Low-Melting Alloy
ASTM B560 Type III
ASTM B560 Type III is a solder & low-melting alloy.
PropertiesAbout these values
- Typical room-temperature values for the default supply condition.
- Bars show where ASTM B560 Type III sits against the other solder & low-melting alloy grades in the catalog (shaded band = 10th–90th percentile, tick = median).
- Confirm against the certified mill / resin datasheet before design release.
About these values
- Typical room-temperature values for the default supply condition.
- Bars show where ASTM B560 Type III sits against the other solder & low-melting alloy grades in the catalog (shaded band = 10th–90th percentile, tick = median).
- Confirm against the certified mill / resin datasheet before design release.
Datasheet
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Against other solder & low-melting alloy grades
Equivalent designations
Standards and trade names that resolve to ASTM B560 Type III in FabDigit's catalog. Equivalence is nominal — check the exact specification when certification matters.
- ASTM
- B560 Type III
- Also called
- 旋压锡合金
Property data is compiled from published supplier and standards handbooks and normalised for comparison; hardness values on non-Brinell scales are converted approximately for charting only. Manufacturability limits are FabDigit quote-engine defaults and may be relaxed by engineering review. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.