Copper Alloy C11000 · print state
Copper Alloy C11000-HIP
Properties of the HIP condition, compared with the other C11000 tempers.
Post-processing route that closes AM/PM porosity to restore near-wrought density, conductivity and ductility.
What is C11000-HIP?
C11000-HIP is C11000 in the HIP condition — post-processing route that closes AM/PM porosity to restore near-wrought density, conductivity and ductility. C11000-HIP has a yield strength of 75 MPa (10.9 ksi) and a tensile strength of 220 MPa (31.9 ksi) — weaker than 90% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 117 GPa (17 Msi). C11000-HIP has a density of 8.9 g/cm³ (0.322 lb/in³), heavier than 76% of copper alloy grades. It melts at 1,065°C (1,949 °F). O is the default condition FabDigit quotes; HIP is available on request or by drawing note.
Advantages
- High electrical conductivity — 99 % IACS, better than 94% of copper alloy grades
- Polishes to a fine finish — 85/100, better than 92% of copper alloy grades
- Ductile — tolerates forming and impact — 45%, better than 91% of copper alloy grades
- Conducts heat well — 385 W/m·K (222.4 BTU/hr·ft·°F), better than 91% of copper alloy grades
- Forms and bends easily — 90/100, better than 87% of copper alloy grades
Limitations
- Low strength — 75 MPa (10.9 ksi), worse than 90% of copper alloy grades
- Difficult to machine — 25/100, worse than 85% of copper alloy grades
C11000-HIP properties
Typical room-temperature values for C11000-HIP — 9 properties are specific to this condition; the rest are grade-level values shared by every C11000 temper. Each bar shows where the value sits among the copper alloy grades in FabDigit's library — further right is higher.
Physical3
C11000-HIP has a density of 8.9 g/cm³ (0.322 lb/in³), heavier than 76% of copper alloy grades. It melts at 1,065°C (1,949 °F).
Mechanical12
C11000-HIP has a yield strength of 75 MPa (10.9 ksi) and a tensile strength of 220 MPa (31.9 ksi) — weaker than 90% of copper alloy grades. Elongation at break is 45% and the elastic modulus is 117 GPa (17 Msi).
Thermal6
C11000-HIP is rated for continuous service to 250°C (482 °F). It conducts heat at 385 W/m·K (222.4 BTU/hr·ft·°F), better than 91% of copper alloy grades. Thermal expansion is 17 µm/m·K (9.44 µin/in·°F).
Electrical3
C11000-HIP conducts electricity at 99 % IACS, better than 94% of copper alloy grades.
Chemical & Environmental3
Corrosion resistance is good (60/100), worse than 69% of copper alloy grades.
Sustainability4
Producing a kilogram of C11000-HIP takes about 53 MJ of energy and emits 3.6 kg of CO₂ — less than 85% of copper alloy grades. Typical recycled content is 35%.
Manufacturability8
C11000-HIP's machinability is poor (25/100, worse than 85% of copper alloy grades); weldability fair (35/100); formability excellent (90/100).
Values are nominal handbook figures for design screening. Certified mill or lot data ships with every FabDigit order on request.
Other C11000 tempers and conditions
C11000 is also supplied in 11 other conditions. The full side-by-side table is on the C11000 overview.
- ODefaultDefault soft temper for deep drawing, bending, riveted busbar tabs and maximum conductivity.69 MPa yield · 45 HB
- H08Spring-hard strip and wire for conductive springs, clips and EMI gaskets.345 MPa yield · 110 HB
- H06Between hard and spring temper for stiff flat springs and stamped contacts.330 MPa yield · 105 HB
- H04Hard drawn rod, wire and strip for maximum strength/stiffness with only minor conductivity loss.310 MPa yield · 100 HB
- Stress RelievedUse when machined or formed cold-worked copper must stay dimensionally stable without full softening.265 MPa yield · 90 HB
- H02Most common cold-worked temper for busbar, terminals and machined parts needing some strength.250 MPa yield · 85 HB
- H01Moderate stiffness with good bendability — roofing, gaskets, formed contacts.205 MPa yield · 75 HB
- H00Slight cold work to flatten strip and stiffen it while keeping ample bend ductility.195 MPa yield · 65 HB
- As PrintedPick for AM heat exchangers, inductors and RF parts printed from C11000/pure-Cu powder (green or IR laser, high-density parameter set).130 MPa yield · 62 HB
- HIPPost-processing route that closes AM/PM porosity to restore near-wrought density, conductivity and ductility.75 MPa yield · 47 HB
Working with C11000-HIP
Is C11000 easy to machine?
Gummy and abrasive to tool edges — use sharp positive-rake carbide, high speed, low feed, plenty of soluble-oil coolant; H02/H04 tempers cut far better than annealed.
Can C11000 be welded?
Prefer brazing or soldering; for fusion use GTAW/GMAW with high preheat and Cu-Si/Cu-Sn filler, but oxygen content makes the HAZ prone to hydrogen embrittlement and porosity — specify C10100/C10200 if welding is critical.
Can C11000 be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, spin, roll form, tight bends); anneal 375–650 °C between severe operations and expect rapid work hardening.
What surface finishes work on C11000?
Not anodizable — bright-dip/pickle then tin, nickel or silver plate for contacts, or lacquer/patinate for architecture; polishes to a high lustre but tarnishes quickly if bare.
C11000 chemical composition (wt %)
Limits by weight percent from the governing specification, written the way the spec states them — a single maximum for impurities, a range for alloying elements, and the base element as balance. Nominal is the typical mid-range value.
| Element | Spec limit (wt %) | Nominal |
|---|---|---|
| Oresidual oxygen inherent to tough-pitch copper; not limited by ASTM B5 | 0.02 – 0.05 | 0.03 |
| Agcounted as copper | ≈ 0 | 0 |
| BiGB/T 5231 T2 limit | ≤ 0 | 5×10⁻⁴ |
| PbGB/T 5231 T2 limit | ≤ 0.01 | 0 |
| Sb | ≤ 0 | — |
| As | ≤ 0 | — |
| Fe | ≤ 0.01 | 0 |
| S | ≤ 0.01 | 0 |
| CuCu + Ag, 99.90 % min per ASTM B5 / GB/T T2 | ≥ 99.9 (balance) | — |
C11000-HIP — frequently asked
What is C11000-HIP used for?
C11000-HIP is typically used for electrical busbars, grounding straps and connectors, terminals and cable lugs, heat-sink bases and cold plates, switchgear and commutator contacts and transformer and motor windings. In short: industrial standard pure copper.
What is the yield strength of C11000-HIP?
C11000-HIP has a typical yield strength of 75 MPa (10.9 ksi) and a tensile strength of 220 MPa (31.9 ksi) — weaker than 90% of copper alloy grades. Strength varies by condition: see the 12 listed tempers.
Is C11000-HIP easy to machine?
Not especially — machinability is rated poor (25/100, worse than 85% of copper alloy grades). Gummy and abrasive to tool edges — use sharp positive-rake carbide, high speed, low feed, plenty of soluble-oil coolant; H02/H04 tempers cut far better than annealed.
Can C11000-HIP be welded?
With care — weldability is rated fair (35/100). Prefer brazing or soldering; for fusion use GTAW/GMAW with high preheat and Cu-Si/Cu-Sn filler, but oxygen content makes the HAZ prone to hydrogen embrittlement and porosity — specify C10100/C10200 if welding is critical.
What surface finishes work on C11000-HIP?
Not anodizable — bright-dip/pickle then tin, nickel or silver plate for contacts, or lacquer/patinate for architecture; polishes to a high lustre but tarnishes quickly if bare.
Can C11000-HIP be formed, bent or molded?
Outstanding cold formability in O temper (deep draw, spin, roll form, tight bends); anneal 375–650 °C between severe operations and expect rapid work hardening.
What is the maximum service temperature of C11000-HIP?
C11000-HIP is rated for continuous use to about 250°C (482 °F). Strength falls off well before that limit — check the elevated-temperature data for load-bearing parts.
What is the difference between C11000-O and C11000-H10?
O is the default condition — default soft temper for deep drawing, bending, riveted busbar tabs and maximum conductivity. H10: maximum cold-worked strength available in ETP strip/wire; almost no bend ductility. Yield strength is 69 MPa in O versus 365 MPa in H10.
Can FabDigit make parts in C11000-HIP?
Yes — C11000-HIP is available for CNC machining, sheet metal and 3D printing with instant online pricing. Upload a STEP file to get a price and a DFM check.
Sources
- ASTM B152/B152M — Copper Sheet, Strip, Plate and Rolled Bar — ASTM (2019)
- ASTM B187/B187M — Copper Bus Bar, Rod and Shapes — ASTM (2020)
- ASTM B5 — Electrolytic Tough Pitch Copper Refinery Shapes — ASTM (2016)
- EN 13601 / CW004A Cu-ETP — CEN (2021)
- C11000 alloy datasheet — Copper Development Association (copper.org) (2023)
- ASM Handbook Vol. 2 — Properties of Nonferrous Alloys — ASM International (1990)
- Pure copper (Cu) L-PBF powder datasheets — various AM powder suppliers (2024)
Property data is compiled from published supplier and standards handbooks and normalised for comparison. Nothing on this page is a certification — request mill certs, CoC or material test reports with your order.